Product portfolio

Equipment built for critical engineering decisions.

Explore systems for thermal interface material characterization, CPU/GPU thermal emulation, vacuum soldering, inline production and pressure-assisted sintering.
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All systems Nanotest budatec Thermal systems Manufacturing systems

Nanotest

Nanotest TIMA 6 precision testing machine with open glass doors showing internal testing components.

Thermal Characterization

TIMA 6

Application-relevant TIM characterization from material screening to accelerated reliability testing.

10–200 °C

sample temperature
range

900 N

continuous force

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Nanotest

Green printed circuit board with a central chip labeled NANOTEST and various connection points.

Thermal Test Vehicles

TTV200

Replicate non-uniform, multi-die GPU and AI accelerator heat loads at system-relevant scale.

7,400 W

maximum package
power

24 / 48

standard / custom
heater zones

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Nanotest

Green circuit board featuring a central metallic square with four yellow sections and several connectors.

Thermal Test Vehicles

TTV16

Controlled CPU-scale power maps for cooling, packaging and chiplet validation.

5,000 W

maximum package
power

24

heater zones

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Nanotest

Two green circuit chips with reflective gold and silver square components mounted on them.

Thermal Test Vehicles

TTV10

A versatile 60 × 60 mm platform for package-scale hotspot and cooling experiments.

2,000 W

maximum package power

4 + 6

main zones + hotspots

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budatec

Budatec VS 320 industrial machine with touchscreen and control buttons in blue and white casing.

Vacuum Soldering

VS 320

Flexible vacuum soldering for medium and large batches, process development and production.

320 × 320 mm

heating plate

Up to 100% H₂

configurable hydrogen
option

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budatec

Industrial machine with two workstations, labeled budatec VS320i, with control screens and safety covers.

Inline Manufacturing

VS 320 i

Autonomous carrier loading and unloading for scalable vacuum soldering production.

Inline-ready

flexible line
integration

Automated

carrier loading and
unloading

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budatec

Budatec SP300 industrial machine with control panel and touchscreen interface.

Pressure Sintering

SP 300

Servo-electric pressure sintering under inert and reduced atmospheres—without hydraulics.

300 kN

maximum adjustable force

220 × 180 mm

maximum process area

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Portfolio at a glance

Select the platform that matches your decision.

Every system page includes intended function, the engineering problem solved, key specifications and direct manufacturer resources.

System

Brand

Category

Best suited for

TIMA 6

Nanotest
Thermal Characterization
Application-relevant TIM characterization from material screening to accelerated reliability testing.
DETAILS
→

TTV200

Nanotest
Thermal Test Vehicles
Replicate non-uniform, multi-die GPU and AI accelerator heat loads at system-relevant scale.
DETAILS
→

TTV16

Nanotest
Thermal Test Vehicles
Controlled CPU-scale power maps for cooling, packaging and chiplet validation.
DETAILS
→

TTV10

Nanotest
Thermal Test Vehicles
A versatile 60 × 60 mm platform for package-scale hotspot and cooling experiments.
DETAILS
→

VS 320

budatec
Vacuum Soldering
Flexible vacuum soldering for medium and large batches, process development and production.
DETAILS
→

VS 320 i

budatec
Inline Manufacturing
Autonomous carrier loading and unloading for scalable vacuum soldering production.
DETAILS
→

SP 300

budatec
Pressure Sintering
Servo-electric pressure sintering under inert and reduced atmospheres—without hydraulics.
DETAILS
→

Not sure which system fits?

Send your material, package, power target or process requirement. We will help define the correct configuration.
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Tucson, Arizona · Serving customers across the United States

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