Solutions for advanced electronics

Solve the bottleneck. Not only the symptom.

Ahmarix organizes equipment around the technical problems it solves—from thermal interface uncertainty and package hotspots to solder voids and sintering process stability.
Discuss your application
view equipment

Application-led portfolio

Six decision areas where controlled data and repeatable processes reduce risk.

Thermal interface material selection and reliability

Thermal resistance inside a package is often dominated by interfaces rather than bulk materials. Ahmarix supports measurement workflows that separate bulk conductivity from interface resistance and show the effects of pressure, bond-line thickness, temperature, cycling and aging.

Recommended systems

TIMA 6

Screen greases, gels, pads, phase-change materials, adhesives, underfills, liquid metals and emerging TIMs. Build data that supports material selection, supplier comparison and design limits.

CPU, GPU and AI accelerator thermal validation

Functional processors are expensive, difficult to instrument and rarely provide controlled boundary conditions. Thermal Test Vehicles act as calibrated thermal twins with controllable heater zones and distributed sensing.

Recommended systems

TTV10 TTV16 TTV200

Validate cold plates, heat sinks, vapor chambers, liquid cooling, direct-to-chip cooling and thermal interface stacks under repeatable hotspot maps and transient loads.

Chiplet and advanced package hotspot analysis

Multi-die packages create thermal coupling between compute dies, memory, interconnect and package structures. Controlled zone-by-zone heating reveals where spreading, interfaces and cooling architecture create bottlenecks.

Recommended systems

TTV16 TTV200

Compare monolithic and chiplet layouts, quantify cooling asymmetry, evaluate hotspot migration and de-risk package architecture before final silicon.

Void-reduced vacuum soldering

Joint voids, oxidation and uncontrolled process atmosphere reduce thermal and mechanical performance. Vacuum soldering combines programmable thermal cycles with vacuum and selectable reducing atmospheres.

Recommended systems

VS 320 VS 320 i

Develop and reproduce soldering processes for power modules, DBC/AMB substrates, baseplates, die attach and other high-reliability electronic assemblies.

Pressure-assisted sintering and die attach

Silver sintering enables high-temperature, high-reliability joints but requires controlled pressure, atmosphere, temperature and tooling. Servo-electric force control improves repeatability and production cleanliness.

Recommended systems

SP 300

Establish stable sintering recipes, scale to large process areas and manufacture power semiconductor assemblies without hydraulic leakage risk.

Local implementation and technical consulting

Specialized equipment projects fail when utilities, samples, fixtures, measurement expectations and acceptance criteria are defined too late. Ahmarix coordinates the technical and commercial interfaces.

Application support

Ahmarix support

Application review, site readiness, transformer and utilities planning, logistics, commissioning, training, test-method development and manufacturer escalation.

The commercial value

Better characterization shortens design loops. Better process control protects yield, reliability and field performance.

The purpose of the equipment is not simply to generate measurements or execute a recipe. It is to create evidence that supports material selection, package architecture, cooling design, process windows and production release.
That means identifying weak interfaces earlier, comparing alternatives under consistent conditions, validating operating margins, and transferring a qualified method into a repeatable workflow.

Start with the engineering question.

We will help map your objective to the correct measurement platform, process system and project scope.
Request an application review