Nanotest · Thermal Interface Material Analyzer

Measure the
interface. Protect the system.

Characterize thermal interface materials under the pressure, temperature, bond-line thickness and aging conditions that determine real package performance.

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Open NANOTEST TIMA 6 device with visible probes and mechanical parts inside.

Nanotest · GPU-CLASS THERMAL TEST VEHICLE

Validate GPU-scale heat. Before silicon limits you.

Reproduce multi-die hotspots and distributed power profiles with up to 7.4 kW of controlled thermal load and dense on-die sensing.

BUDATEC - VACUUM SOLDERING SYSTEM

Build cleaner solder joints. With controlled process conditions.

Develop and produce void-reduced solder joints with programmable vacuum, atmosphere and thermal profiles on a 320 × 320 mm process platform.

BUDATEC - FULLY AUTOMATIC SINTERING PRESS

Scale pressure sintering. With precise, hydraulic-free force.

Create reliable sintered joints under inert or reduced atmospheres with servo-electric force control up to 300 kN.

Thermal characterization

Quantify TIM performance, pressure dependence, bond-line thickness and reliability with TIMA systems.

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Simplified teal icon of a microchip with pins extending from all sides.

Thermal test vehicles

Reproduce CPU, GPU and chiplet power maps with controlled heaters and integrated temperature sensing.

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Manufacturing systems

Develop and scale vacuum soldering and pressure-assisted sintering for reliable electronics production.

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ENGINEERING SOLUTIONS FOR

Semiconductors

AI & HPC

Power electronics

Automotive & EV

Aerospace

Research

FEATURED SYSTEMS

From material characterization to production-ready manufacturing.

Ahmarix brings selected European high-technology systems to U.S. engineering and production teams—with local application support and direct access to the manufacturers behind the equipment.

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Nanotest

Thermal Characterization

TIMA 6

Application-relevant TIM characterization from material screening to accelerated reliability testing.

10–200 °C

sample temperature
range

900 N

continuous force

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Nanotest

Thermal Test Vehicles

TTV200

Replicate non-uniform, multi-die GPU and AI accelerator heat loads at system-relevant scale.

7,400 W

maximum package
power

24 / 48

standard / custom
heater zones

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budatec

Vacuum Soldering

VS 320

Flexible vacuum soldering for medium and large batches, process development and production.

320 × 320 mm

heating plate

Up to 100% H₂

configurable hydrogen
option

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budatec

Pressure Sintering

SP 300

Servo-electric pressure sintering under inert and reduced atmospheres—without hydraulics.

300 kN

maximum adjustable force

220 × 180 mm

maximum process area

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Nanotest

Green circuit board with a central chip having four yellow segments and multiple connectors.

Thermal Test Vehicles

TTV16

Controlled CPU-scale power maps for cooling, packaging and chiplet validation.

5,000 W

maximum package
power

heater zones

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budatec

Inline Manufacturing

VS 320 i

Autonomous carrier loading and unloading for scalable vacuum soldering production.

Inline-ready

flexible line
integration

Automated

carrier loading and
unloading

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Problems solved

Better decisions before thermal or process limits become failures.

The portfolio is organized around the engineering decisions your team needs to make: material selection, package design, cooling validation, joining process development and production transfer.

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Thermometer icon with sun and flames representing high temperature or heat.

01

Select and qualify thermal interface materials

Compare materials under controlled temperature, pressure and bond-line thickness—then verify aging and cycling behavior before design release.

Icon of a microchip with a snowflake symbol in the center representing cooling or refrigeration.

02

Validate advanced cooling concepts

Use CPU- and GPU-class thermal test vehicles to quantify cold plates, vapor chambers, liquid cooling and heat spreaders under realistic spatial loads.

Line art icon of a laptop displaying a webpage with text blocks and a header.

03

Understand hotspots and package interaction

Create repeatable power maps and measure thermal coupling between dies, chiplets, package layers and cooling components.
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Icon of robotic arm placing boxes on a conveyor belt, symbolizing manufacturing or packaging.

04

Reduce voids and improve solder reliability

Develop controlled vacuum soldering profiles with configurable atmospheres, oxide reduction and optional plasma pre-cleaning.

Icon of a hydraulic press machine with a lever on the right side in turquoise lines.

05

Transfer sintering into stable production

Apply precise, repeatable pressure under controlled atmospheres using servo-electric sintering systems built for production.

Line icon of a smiling customer support agent with headset, computer, and speech bubble.

06

Connect equipment with application knowledge

Receive U.S.-based technical clarification, system selection, site-readiness support, training and manufacturer coordination.

WHY AHMARIX

One local partner. Direct access to specialized engineering.

Ahmarix supports the full path from the first technical question to a running system in your laboratory or production environment.

Icon showing four horizontal slider controls for adjusting settings or preferences.

Application-first system selection

We start with your material, package, cooling concept or manufacturing process—not a generic product list.

Blue outlined handshake icon with emphasis lines above hands.

Direct manufacturer coordination

Technical questions, custom configurations and project risks are discussed with the engineers who design the systems.

Outlined hands holding a gear with a wrench inside, symbolizing technical support or maintenance.

U.S.-based implementation support

Site readiness, utilities, logistics, commissioning, training and ongoing service coordination are handled locally.

ABOUT AHMARIX

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Measure the interface. Protect the system.

Validate GPU-scale heat. Before silicon limits you.

Build cleaner solder joints. With controlled process conditions.

Scale pressure sintering. With precise, hydraulic-free force.

Thermal characterization

Thermal test vehicles

Manufacturing systems

Semiconductors

AI & HPC

Power electronics

Automotive & EV

Aerospace

Research

From material characterization to production-ready manufacturing.

TIMA 6

TTV200

VS 320

SP 300

TTV16

VS 320 i

Better decisions before thermal or process limits become failures.

01

Select and qualify thermal interface materials

02

Validate advanced cooling concepts

03

Understand hotspots and package interaction

04

Reduce voids and improve solder reliability

05

Transfer sintering into stable production

06

Connect equipment with application knowledge

One local partner. Direct access to specialized engineering.

Application-first system selection

Direct manufacturer coordination

U.S.-based implementation support

Let’s define the right test or process system.

EXPLORE

COMPANY

LEGAL

Measure the
interface. Protect the system.