Industries served
Where electronics performance depends on heat and joining quality.
The Ahmarix portfolio supports organizations that design, validate or manufacture electronic materials, packages, modules and cooling systems.
Broad relevance
From material suppliers to hyperscale computing.
Thermal resistance, hotspot control, solder quality and die-attach reliability are cross-industry constraints. The equipment scales from laboratory material studies to production manufacturing.
Semiconductors & advanced packaging
Thermal interface qualification, chiplet hotspot emulation, package-stack validation, reliability testing and process development.
AI, HPC & data centers
GPU/accelerator thermal twins, high-power cold plate validation, liquid cooling development and TIM1/TIM2 reliability.
OSAT, EMS & contract manufacturing
Vacuum soldering, sintering, process transfer, quality assurance and equipment integration for electronics assembly.
Automotive & electric vehicles
Power module joining, inverter thermal management, high-reliability die attach and long-duration thermal cycling.
Aerospace & defense
Qualification of materials, cooling systems and electronic assemblies under demanding reliability requirements.
TIM, adhesive & chemical materials
Application-relevant characterization of greases, gels, pads, phase-change materials, underfills, adhesives and liquid metals.
Power electronics & wide-bandgap
SiC/GaN module thermal paths, substrate bonding, baseplate soldering and pressure-assisted sintering.
Cloud infrastructure & server OEMs
Cooling architecture benchmarking for servers, accelerators, CPUs, GPUs and high-density computing platforms.
Industrial electronics & automation
Reliable joining and thermal design for drives, controls, robotics, power conversion and harsh-environment electronics.
LED & optoelectronics
Thermal path characterization, interface selection and joining quality for high-power LEDs, lasers and optical modules.
Energy, renewables & storage
Thermal and joining solutions for inverters, converters, battery power electronics and grid equipment.
Universities & research institutes
Flexible platforms for material science, thermal management, advanced packaging and manufacturing-process research.
A connected value chain
Use the same evidence across materials, package, cooling and production teams.
Material suppliers can quantify performance under application conditions. Package and cooling teams can reproduce realistic heat loads. Manufacturing teams can qualify vacuum soldering and sintering processes. Together, these workflows reduce handoff risk across the electronics value chain.
Discuss your industry application
Your industry may be different. The thermal physics is not.
Share the component, material, package or production process you are working on.