Name: Nanotest TTV16 CPU-Class Thermal Test Vehicle
Brand: Nanotest

5,000 W

maximum package power

24

heater zones

56

on-die RTD sensors

40 × 40 mm

CPU-scale die area

What it does

Controlled CPU-scale power maps for cooling, packaging and chiplet validation.

TTV16 recreates the thermal and electrical behavior of high-performance CPU architectures using a 40 × 40 mm monolithic or four-die chiplet platform. Twenty-four controllable heater zones and 56 on-die RTDs make localized power patterns and temperature gradients measurable and repeatable.

Engineering problem solved

Move from assumption to controlled, repeatable evidence.

CPU and chiplet packages no longer behave as uniform heat sources. TTV16 lets engineering teams reconstruct realistic workload patterns and quantify the resulting gradients before committing to functional silicon or final cooling hardware.

Typical applications

Where TTV16 creates value.

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CPU and chiplet thermal architecture development

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Air, liquid, cold-plate and vapor-chamber benchmarking

Localized hotspot and thermal spreading analysis

Thermal interface and package-stack qualification

Power cycling and interconnect health monitoring

Key technical information

Configuration overview.

Final performance and configuration depend on the selected system options, control hardware, accessories and application. The manufacturer datasheet remains the controlling technical source.

Chip format

Monolithic or four-die chiplet configuration

Heater zones

24 independently controllable zones

Maximum power

5,000 W

Power density

Up to 3.2 W/mm²

Temperature sensing

56 on-die four-wire RTD sensors

Maximum operating temperature

125 °C

Package interface

78 × 57 mm BGA package with Electronic Test Board

Control configurations

TCU6, TCU9 and TCU24 options

Manufacturer resources

Nanotest product information

Review the current manufacturer page and technical download, then contact Ahmarix for U.S. configuration, quotation and implementation support.

Manufacturer page

→

Technical download

→

Configure TTV16 for your application.

Share your operating conditions, test objective, sample or production requirements.

Talk to an ahmarix specialist

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TTV16

5,000 W

24

56

40 × 40 mm

Controlled CPU-scale power maps for cooling, packaging and chiplet validation.

Move from assumption to controlled, repeatable evidence.

Where TTV16 creates value.

Configuration overview.

Chip format

Heater zones

Maximum power

Power density

Temperature sensing

Maximum operating temperature

Package interface

Control configurations

Manufacturer resources

Nanotest product information

Configure TTV16 for your application.

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